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      1. Capabilities

        COB

        Chip On Board
        Chip On Board Chip On Board
        Chip On Board
        COB Bonding
        • Fine pitched ball screw providing XY table
        • Auto-Calibration ultrasonic generator
        • Bond quality monitoring system
        • Dual monitor display
        • Digital bond head and rotary work chuck
        • Cycle time: 250ms for 2.0mm long wire (1 die)
        • Bond angle: 30o
        • Wire size: 25.4~50.8μm dia.
        • Bond force: 15~150g
        • Bond power: ~1W
        • Bond placement: ±20.4μm(3σ)
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